Aliran Proses
Aliran Proses
Aliran Proses Papan Flex-Tegar
Keupayaan Proses PCB
|
projek |
Parameter |
|
Bilangan lapisan |
1-40lapisan |
|
Saiz PCB maksimum |
730mm*630mm |
|
Ketebalan PCB siap |
0.3mm~5.0mm |
|
Saiz lubang gerudi mekanikal |
0.15mm~6.5mm |
|
Saiz gerudi laser |
75μm~150μm |
|
Ketebalan tembaga maksimum |
10OZ |
|
Ketebalan teras paling nipis |
0.05mm |
|
Lebar garisan minimum (20±3 kuprum permukaan) |
0.05mm/2mil |
|
Jarak garisan minimum (20±3 kuprum permukaan) |
0.05mm/2mil |
|
Cincin litar minimum |
3 juta |
|
Garis besar minimum Toleransi |
±0.1mm |
|
projek |
Keupayaan proses pengeluaran besar-besaran |
Keupayaan jarak yang melampau |
|
Saiz maksimum |
630*730mm |
630*730mm |
|
Toleransi kedudukan lubang |
±0.05mm |
±0.038mm |
|
Saiz apertur mekanikal |
Ø0.2mm~Ø6.5mm |
Ø0.15mm~Ø6.5mm |
|
Saiz gerudi laser |
100μm |
Ø75μm~Ø150μm |
|
Saiz lubang slot minimum |
Ø0.50mm |
Ø0.45mm |
|
Toleransi saiz PTH |
±0.075mm |
±0.05mm |
|
Toleransi saiz NPTH |
±0.05mm |
±0.05mm |
Menggerudi
Penyaduran
barisan
|
projek |
Keupayaan proses pengeluaran besar-besaran |
Keupayaan jarak yang melampau |
|
saiz pengeluaran proses penyaduran elektrik |
≤730mm |
≤735mm |
|
Ketebalan proses penyaduran elektrik |
0.3mm~2.0mm |
0.2mm~2.4mm |
|
Ketebalan tembaga lubang |
13μm~25μm |
13μm~40μm |
|
Keseragaman ketebalan kuprum permukaan |
R≤0.004mm |
R≤0.002mm |
|
Keseragaman ketebalan tembaga lubang |
±0.005mm |
±0.003mm |
|
keupayaan kedalaman melalui lubang |
8:1 |
10:1 |
|
Keupayaan kedalaman lubang buta |
0.8:1 |
1:1 |
|
projek |
Keupayaan proses pengeluaran besar-besaran |
Keupayaan jarak yang melampau |
|
Ketebalan PCB |
0.075~5.0mm |
0.05~5.0mm |
|
Dedahkan toleransi kedudukan |
±0.015mm |
±0.008mm |
|
Cincin lubang min |
Unilateral≥0.04mm |
Unilateral≥0.03mm |
|
1/3 OZ asas tembaga lebar garisan minimum/jarak talian |
0.05mm/0.05mm |
0.045mm/0.045mm |
|
1/2 OZ asas tembaga lebar garisan minimum/jarak baris |
0.075mm/0.075mm |
0.05mm/0.05mm |
|
Toleransi goresan tembaga asas 1 OZ |
0.1mm/0.1mm |
0.075mm/0.075mm |
|
Toleransi goresan tembaga bawah 1/3 OZ |
±0.005mm |
±0.005mm |
|
Toleransi goresan tembaga bawah 1/2 OZ |
±0.005mm |
±0.005mm |
Keupayaan Proses PCBA
|
ITEM |
Keupayaan am |
Keupayaan khas |
|
Saiz maksimum |
50x50mm-810x490mm |
810×490mm |
|
Min PITCH |
0.4mm-4mm |
0.38mm3.8mm |
|
Jarak PIN min |
0.15mm |
0.14mm |
|
Diameter BGA min |
0.25MM |
0.22MM |
|
Saiz min komponen |
0201 CHIP |
01005 CHIP |
|
Saiz maksimum komponen |
32mm |
45mm |
|
Ketinggian maksimum komponen SMT |
≤10mm |
13mm |
|
mengawal ketepatan ketebalan tampal pateri |
±0.04mm |
±0.03mm |
|
ketepatan mengimbangi percetakan tampal pateri |
±0.05mm |
±0.025mm |
|
Ketepatan penghijrahan unsur |
≤0.15mm |
≤0.10mm |
|
ketepatan unsur terapung tinggi |
≤0.15mm |
≤0.10mm |
|
Jarak minimum antara komponen dan bahagian |
0.3mm |
0.25mm |
|
Jarak minimum antara komponen dan bahagian (Borang-Di-Tempat) |
≥0.6mm |
0.4~0.6mm |
|
jarak minimum antara bahagian dan ujian (Borang-Di-Tempat) |
≥0.7mm |
0.5~0.7mm |
|
lebar minimum gam (Borang-Di-Tempat) |
0.8mm8 |
0.6mm6 |
|
jarak minimum antara bahagian dan tepi bentuk (Form-In-Place) |
≥1mm |
0.7~1mm |
Cadangan Berita
